Product assembly at Electronics Yorkshire
Place BGAs, CSPs and QFNs on PCBs in small batch or rework using infra-red
Electronics Yorkshire’s ERSA IR/PL 550 BGA rework equipment is an integral system for reworking Ball Grid Arrays and Chip Scale Packages using Infra Red heat source.
The IR/PL 550 system is designed for small to medium size PCBs (up to approximately 200mm by 250mm). The combined unit offers the greatest flexibility for interaction with a system so operators can handle the most complex surface mount and through hole technology rework applications. A time/temperature profile is developed to allow the heat transfer through the chip to reflow the solder balls. In order to do this, heat is applied to both top and bottom of the PCB and the device that has been positioned by means of the optical (split screen) system.
IR 550 Selective Reflow Module
The IR 550 module uses DynamicIR Heating Technology for fully automatic dynamic control of the top and bottom Infra-Red heaters, utilising the actual temperature of the component and/or PCB to drive the heating system. Depending on board size, thermal mass of the substrate, and component size, the unique heaters guarantee that the required heat energy is delivered at the precise time and location in order to ensure that the component exactly follows the prescribed temperature profile. Combined with the enhanced capability to run a flat peak, this revolutionary technology affords the lowest temperature deltas across the component, and greatly reduces PCB warping.
PL 550 Precision Placement Module
The PL 550 is a proven precision placement system designed for the largest range of components and includes reflow process viewing. A pressure triggered component placement head drops off the component at the same contact pressure as an in-line pick and place machine. This auto component drop-off guarantees safe and precise results. Incorporated into this equipment is a camera that is focused on to the chip providing a real time view of the melting point, thus ensuring exact calibration is recorded. This equipment can also be used to place and rework QFN (Quad Flat No leads) packages.
Resolve BGA issues on larger boards
The ERSA IR / PL 650 BGA rework equipment combines all the advantages of the Ersa IR/PL 550, but for larger PCBs
The IR/PL 650 affords the highest degree of automation and is specifically designed for large (up to approximately 460mm x 560mm) and complex PCBs. The DynamicIR Heating Technology has nine programmable top and bottom heating zones, whilst the precise, motorised auto pick and place affords the highest quality placement.
IR 650 Selective Reflow Module
The IR 650 reflow module utilises ERSA’s DynamicIR heating technology for fully automatic control of the top and bottom infra-red heaters. The total available power to the selective reflow system of 4600 W is spread across four separately controllable heating zones on the top and five zones on the bottom. Depending on board size, the thermal mass of the substrate and component size, the heating technology guarantees that the required heat energy is delivered at the precise time and location to ensure the component and board exactly follow the prescribed temperature profile, which greatly reduces PCB warping.
PL 650 Precision Placement Module
The PL 650 placement module is designed for the largest range of components, increased automation, and guaranteed repeatability. A highly sophisticated, pressure triggered component placement head drops off the component at the same contact pressure as an in-line pick and place machine. A high-resolution camera with motorised zoom permits highly precise alignment of component leads to lands with up to 300x enlargement. The excellent image quality is supported by a high-contrast, separately controlled 2 colour LED lighting system from four sides. The Auto Pick & Place mode guarantees repeatable and precise results.
APR-5000-DZ Array Package Rework System
This system, from Oki, has been added to the range of complex package placement and rework equipment. This not only allows for the placement of BGA and CSP devices using hot gas, but also has the capability for reworking Package on Package (PoP) devices.
Reball BGAs and CSPs
A Reballer enables BGA and CSP packages to be reballed, whether due to a change of solder metallurgy or simply down to reworking. Reballing can be carried out in most instances, but is dependent on the component and its related data sheets.
To arrange to hire equipment at Electronics Yorkshire, call 0800 610 1602 or email: firstname.lastname@example.org; if you require Electronics Yorkshire to carry out work please contact us to check availability.