Resolve production problems and assemble complex products

Electronics Yorkshire can help you assemble complex product without the problems associated with high capital investment and low site usage.

Areas in which we can assist either by inspecting and testing your products or allowing you and your specialists to carry out the work yourselves:

• X-ray NDT Investigation
• XRF Elemental Spectroscopy
• Microsectioning
• Environmental Testing
• BGA Inspection & Reworking
• Optical Inspection
• Thermal Imaging
• Non-mechanical investigation

 

Tasks that can be performed with equipment at Electronics Yorkshire’s Technology Centre:

Click on the headings below to get further information

Carry out material composition and plating thickness analysis

The Fischerscope XDAL X Ray Spectrometer carries out a rapid elemental analysis of electronic components and PCBs to determine, for instance, the surface thickness of plating or, in line with RoHS directive, verify the presence of harmful elements.
 

Prove a finished product can withstand its operating environment

The Votsch Environmental Chamber provides a cyclic programme of temperature and humidity testing to prove whether a finished product can withstand it operating environment, or detect and eliminate malfunctions at an early stage in the development phase of a product.
 

100 percent BGA, µBGA, PoP and QFN inspection, component solder joint inspection and multilayer board inspection

The majority of solder connections cannot be visually inspected on many newer types of components, such as BGAs and flip-chip devices; to address this Electronics Yorkshire has an X-Tek [Nikon] X-ray Inspection System, which can detect a widest range of defects.
 

Place BGAs, CSPs and QFNs on PCBs in small batch or rework

The ERSA IR/PL 550 BGA rework equipment is an integral system for placing Ball Grid Arrays, Chip Scale Packages and Quad Flat-packs (with No leads) using Infra Red heat source. The IR/PL 550 system is designed for small to medium size PCBs (200mm by 250mm).
 

Resolve BGA issues on larger boards

The Ersa IR/PL 650 BGA rework equipment combines all the advantages of the Ersa IR/PL 550 but has been developed for work to be carried out on larger PCBs (460 x 560mm).
 

Reball BGAs and CSPs

The Reballer enables most BGA and CSP packages to be reballed, whether due to a change of solder metallurgy or simply down to reworking.
 

Inspect and diagnose BGA and CSP device soldering faults on PCBs

The ErsaScope Optical Inspection System was specifically designed to inspect BGA and CSP devices on PCBs. With the ErsaScope defects may be found that would go undetected by other inspection methods; as such it offers the perfect complement to Electronics Yorkshire’s other scopes and x-ray system.
 

Detailed fault analysis of PCB and solder structures

Electronics Yorkshire's microsectioning kit, consisting of a Buehler IsoMet precision sectioning saw and a grinder/polisher, can be used to perform quality checks on PCBs, detailed fault analysis on solder structures, or used to prove that a  soldered connection was good.
 

Visually check copper plating thickness, fillet height, component dimensions, etc, after microsectioning

The Vision Engineering Hawk's extremely accurate three-dimension measuring system can be used for checking. for instance, plating thickness, solder resist, fillet height or component dimensions. The non-contact measuring microscope is ideal for use in conjunction with Electronics Yorkshire's microsectioning kit.
 

Locate hot areas on PCBs and associated equipment with thermal imaging

The Land Cyclops Thermal Imaging Camera, using the latest infra-red image processing, can be used effectively in the electronics industry to confirm heat dissipation of a product. It can also be used to ensure that the electrical systems within a building are not running ‘hot’. Images can be saved for later use.

 

To arrange to hire equipment at Electronics Yorkshire, call 0800 610 1602 or email: info@eytechnology.org.uk; if you require Electronics Yorkshire to carry out work please contact us to check availability.

Please note that hire of certain equipment within the  Technology Centre is in significant demand. As a result, bookings for hire of any piece of equipment will be confirmed back to customers immediately on receipt by e-mail. Any booking which is cancelled 48 hours or less before the date booked will be invoiced in full. Provisional bookings for equipment hire cannot be accepted.